ARAMIS enables with its digital image correlation (DIC) functionalities the analysis of displacements and mechanical deformations of material specimens and components. In combination with thermography measurements, the thermal specimen behavior can be evaluated together with the mechanical deformation.
This webinar will discuss the combination of GOM ARAMIS DIC evaluations with thermography measurements using IR cameras from InfraTec.
With the unique software feature in ARAMIS, you can analyze the correlation between mechanical and thermal deformations in detail and speed up your development time thanks to the comprehensive understanding obtained about your materials or components.
On May 15, 2019, at 9:00 a.m. CEST, 1:00 p.m. CEST and 5:00 p.m. CEST, GOM and InfraTec invite you to the webinar “Analyzing thermal and mechanical deformations with DIC and thermography” held in German and English including the following topics: