An advanced photogrammetry method using 3D image correlation is substantially more robust and has greater dynamic range than other full-field imaging technologies such as ESPI, shearography and moiré. In addition, this 3D image correlation technology is simpler to use and less expensive to implement. The technology is inherently three-dimensional, measuring total deformation of complex objects and their shape, rather than relative deformation. As an example, for composites failure analysis, this technology is hundreds of times less sensitive to vibration interference than ESPI, can collect data 30 times faster, and has a much higher dynamic range of deformation measurement. These attributes are particularly critical during dynamic deformation analysis such as during plastic deformation and defect propagation. The dynamic range of the 3D image correlation technology allows the operator to measure the event that is occurring, rather than modifying the event to meet the requirements of the measurement method. The events can be in microns to millimeters of deformation, static or dynamic, with no requirement for sub-micron stability. Furthermore, the use of stroboscopic illumination enables dynamic response measurements beyond the capability of pulsed ESPI systems. Typical applications range from full-field stress-strain measurement, such as tensile testing and metal forming analysis, to large structure static and dynamic deformations and nondestructive testing. Examples presented include strain fields at a crack tip with 3 point bending, human tendon response under tension, and strains in a tire sidewall at high speed. | 
