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Low-Cost Electrical Resistance Spot Welding Technique for Micro-Optical Component Mounting with Sub-Micron Tolerance 
ARAMIS
 
Systèmes de mesure: ARAMIS
 
Keywords: sub-micron tolerance, 3d image-correlation
 
N. Woodard, E. Johnson, J. Demers, C. Chen, R. T. Logan Jr. (Phasebridge, USA);
J. Nielsen (University of Southern California, USA)

August 2003

  
 
We report on a novel technique for achieving threedimensional optical component placement and attachment with sub-micron tolerance using low cost electrical resistance spot welding. We developed this technique to realize optical chip-to-chip two-lens single mode waveguide interconnects in an integrated module incorporating a distributed-feedback (DFB) laser diode chip coupled to a lithium-niobate modulator chip. Our technique is high-yield, and requires no post-weld adjustment. The novel weld clips are low-cost etched parts, and incorporate an articulated foot structure that permits ultra-precise motion while simultaneously attenuating post-weld-shift. The tooling and welding heads form a very small overall footprint, allowing unprecedented overhead access for easy incorporation of parts loading and vision systems. We present characterization data including post-weld-shift measurements, temperature-stability data, and 3D image-correlation maps of temperature stability.

The complete publication in English is available, please use the .pdf Download.
 
Low-Cost Electrical Resistance Spot Welding Technique for Micro-Optical Component Mounting with Sub-Micron Tolerance
 

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